Boundary-Condition-Independent Resistor Network Thermal Model of Flip Clip Ceramic Ball Grid Array Electronic Package

A boundary-condition-independent resistor network thermal model of flip chip ceramic ball grid array (FC-CBGA) electronic package was investigated. According to the roadmap of the thermal model, a 3-D detailed model of FC-CBGA was set up by a finite volume mathematical method. The average discrepancy of resistance was lower than 3.78% by comparing with experimental results, which verified the availability of the 3-D detailed model. Based on the above results, a three-thermal resistor model of FC-CBGA is presented in this research. The errors of the junction temperature compared between two models are lower than 4% for twenty-one kinds of boundary conditions including cold plate, heat sink and forced convection etc. The results show that the three-thermal resistor model is independent of boundary conditions and much simpler. It can not only simulate precisely the junction temperature and thermal resistance, but also substitute totally for the detailed model to analyze the thermal path and thermal management of electrical systems.