A Study on the Grain Orientation and Grain Boundary of Electroformed Copper

The microstructure, grain orientation and grain boundary in electroformed copper prepared under specific conditions were studied using SEM, TEM and EBSD. SEM and TEM observations showed that the microstructure of electroformed copper along the thickness direction of deposition consists of fine equiaxed grains zone, mixture zone of equiaxed and columnar grains and large columnar grain zone. EBSD analysis indicates that distributing the ratio of low-angle grain boundary(＜15°)is lower and high-angle grain boundary (≥15°) is the dominating boundary in the electroformed copper. The high angle boundaries are mainly CSL and the ratio of ∑3 among CSL is relatively high. Columnar grains consist of parallel twin lamellar of which the normal is along the thickness direction. In the fine equiaxed grains zone, the preferred orientation of grains is not obvious. In mixture zone and large columnar grain zone, the preferred orientations of grains are 〈111〉 and 〈101〉. Large columnar grain zone shows strong 〈111〉 texture.