Deposition of (Ti,Cr)N Film on LY12 Aluminum Alloy Substrate Through Multi-Arc Ion Plating

The feasibility of depositing （Ti,Cr）N film on LY12 aluminum substrate is studied and the parameters involved are optimized by orthogonal-design optimization tests. The chief deposition parameters in multi-arc （Ti,Cr）N film processes include the target composition, deposition time, bias voltage, partial pressure of nitrogen and arc current, concerning their influences on the film performance and quality. Corrosive resistance and frictional characteristics of the film are studied. With the deposition parameters: target component w （Ti）=80%, （ w （Cr）=）20%, deposition time 30 min, bias voltage 200 V, N₂ partial pressure 3.0 Pa and arc current （75 A,） the resulting （Ti,Cr）N film deposited on LY12 aluminum substrate has a binding force of （44 N） and a film thickness of 1.77 μm.