Sun Xihuan, Chen Chuanning. The Application of Electronic Shear Speckle Test System to Measurement of Thermal DeformationJ. Transactions of Beijing institute of Technology, 1995, (4): 381-386.
Citation: Sun Xihuan, Chen Chuanning. The Application of Electronic Shear Speckle Test System to Measurement of Thermal DeformationJ. Transactions of Beijing institute of Technology, 1995, (4): 381-386.

The Application of Electronic Shear Speckle Test System to Measurement of Thermal Deformation

  • The experimantal study of deflection induced by a radial linear temperatural field applied tothe equally thick circular plate was done by the electronic shear speckle test system. The test result is consistent with the theoretical solution. So the test system can be used in the measurement of displacement gradient of body under the temperatural field, and then all the field displacement of body's surface can be obtained.
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