Abstract: Used widely in the assembly of small precision devices, adhesive bonding still presents bonding stress problem resulted from curing shrinkage, relaxation creep and thermal mismatch, affecting the accuracy and performance stability of assembled products. To achieve high-precision and high-stability adhesive assembly, silica powder is usually used to modify adhesives in engineering. To solve the problem of lacking quantitative characterization of key material parameters such as curing shrinkage and mechanical properties of adhesives, and to get key parameters of adhesive assembly for the stress analysis in this paper, the tensile strength, elastic modulus, relaxation modulus, thermal expansion coefficient, and curing shrinkage of epoxy adhesive 7-2312 were measured experimentally for the precision inertial devices. And the effects of silica powder modification on the curing shrinkage and mechanical properties of 7-2312 epoxy adhesive were discussed. The results show that the tensile strength, elastic modulus, and relaxation modulus of the adhesive increase with the increase of silica powder content, and the relaxation modulus decreases first and then increases. The sensitivity of adhesive relaxation modulus to ambient temperature decreases first and then increases with the increase of silica powder content. The thermal expansion coefficient and curing shrinkage of the adhesive decrease with the increase of silica powder content.