Abstract: The influence of random vibration on optoelectronic PCB reliability was analyzed. In the product conceptual design stage, a three-dimensional finite element model of photoelectric PCB was established. Photoelectric PCB mode parameters which obtained under the four-point fixed condition were studied. Result shows that the frequency difference between the 1st and the 2nd order, or between the 4th and the 5th order is small, and the multi-order resonance phenomenon is likely to occur between the adjacent orders. The random vibration response analysis under dynamic environment which defined by GJB 150.16-86 was carried out using the Block Lanczos method. Especially, the research focused on the impact of random vibration load on optoelectronic PCB, including the warpage of optoelectronic PCB, solder joints reliability, optical coupling efficiency and optical fiber reliability.